I think it is beter to use Silicon, which easily can be removed

                                                                 Salem Saadon
                       Collaborative micro-Electronic Design Excellence Centre
(CEDEC).
             University Science Malaysia (USM), Engineering Campus, 14300 Nibong
Tebal,
                                                          PULAU PENANG, MALAYSIA
(+6017)-4475865



________________________________
 From: Hong Wang 
To: mems-talk@memsnet.org
Sent: Thursday, 23 May 2013, 2:55
Subject: [mems-talk] work with thin wafers


Dear All,
We start working on lithography and bonding process using  170 um thin
fused silica  for microfluidic devices. We always got broken wafers.
We are looking for materials and techniques for supporting the thin wafer.
The support wafer should be easily removed after the device is assembled.
Any input will be appreciated.
Hong
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_______________________________________________
Hosted by the MEMS and Nanotechnology Exchange, the country's leading
provider of MEMS and Nanotechnology design and fabrication services.
Visit us at http://www.mems-exchange.org

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To unsubscribe:
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