Thanks Andrew and Robert,
The substrate I'm working on is porous silicon, I have tried
(1) Prolift100 series (which can fill pores of porous silicon, and be
removed by TMAH developer, but it becomes difficult to remove Prolift in
thick substrate with fine photoresist features on top, besides, long
developing time will damage the substrate and photoresist patterns).
(2) VM-651 (which can fill pores but is difficult to be removed after soft
bake).

I considered BARCs before, however, I'm afraid that it will introduce the
same problem as Prolift, so it would be better if this material can be
removed by other solvent but not developer, so it won't affect the
photoresit patterns.

Best regards,
Xiao



On 23 May 2013 22:45, Black, Robert  wrote:

> There are developable BARCs out there, but they only coat about 60nm. You
> may have to double coat them. They are removed with developer.
>
> -----Original Message-----
> From: mems-talk-bounces+r-black1=ti.com@memsnet.org [mailto:
> mems-talk-bounces+r-black1=ti.com@memsnet.org] On Behalf Of Xiao
> Sent: Wednesday, May 22, 2013 3:14 AM
> To: mems-talk@memsnet.org
> Subject: [mems-talk] high viscosity material
>
> Hello everyone,
>
> I am trying to find a high viscosity material that can fill pores (<100nm)
> of a substrate, then do patterning with photoresist on it, and removed this
> material with some solvent or even DI water, but not affecting the
> photoresist patterns.
>
> We have tried several materials for now, but didn't work very well, do you
> have any ideas of this material? Thank you!
>
> Best regards,
> Xiao
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