We've had good adhesion to silicon with the 2000 series without Omnicoat. I
think if you don't need to release the structures don't use it on silicon.
Usually we do a 2 min hotplate bake at 150C before spinning.

Also, I see that MicroChem is recommending that you can use HMDS as an adhesion
promoter.  Google SU-8 2050.  With thicker layers like this you should use the 2
step baking process: 1. 65C and 2. 95C for soft and hard bakes.  Finally finish
with a high temperature bake 115 or 150C to really set the epoxy.

-----Original Message-----
From: mems-talk-bounces+michael.martin=louisville.edu@memsnet.org [mailto:mems-
talk-bounces+michael.martin=louisville.edu@memsnet.org] On Behalf Of Gareth
Jenkins
Sent: Wednesday, July 03, 2013 1:03 AM
To: General MEMS discussion
Subject: Re: [mems-talk] SU8 100um adhesion failure

I had a similar problem when using Omnicoat. I was recommended to triple coat
the Omnicoat and bake at 200C on a hotplate for 5 minutes and then increase
exposure dose by about 30%.
I never tried this advice but would be interested to know if it works. N.B.
do you get good adhesion on bare silicon without Omnicoat? I think Omnicoat may
only be useful as a release layer.


On 2 July 2013 21:16, Tong CHEN  wrote:

> Hello,
>
> dose anybody use SU-8 2050 to make 100um of thickness, I have totally
> adhesion failure when I deposit it on a Omnicoat(from Microchem
> too)surface on Si, when I do the development, the patterns can be
> removed by twizzer, I made up to 550mj/cm2 of exposure, and PEB 95C 12 min, it
still didn't work.
> I don't know where the problem is.
>
> Thanks for your help
>
> --
> Tong Chen
> Postdoc
> SyntheCell Team
> IGDR CNRS UMR 6290
> 2, Avenue du Professeur Léon Bernard
> 35043 Rennes
> France
>
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