Hello,

I am currently using SU-8 2025 to make 500µm thick devices (without
multiple layers) and I don't have adhesion problems. How long is your
pre-exposure bake ? You can try to increase the exposure dose and/or the
pre-exposure bake duration to avoid adhesion problems. In addition, it is
important to let the resin relax at room temperature between each step of
the protocol to avoid too many constraints.

Best regards,

Sophie Roman

Post-doc
Laboratoire Charles Coulomb,
place Eugène Bataillon,
Montpellier 34090
France


2013/7/2 Tong CHEN 

> Hello,
>
> dose anybody use SU-8 2050 to make 100um of thickness, I have totally
> adhesion failure when I deposit it on a Omnicoat(from Microchem too)surface
> on Si, when I do the development, the patterns can be removed by twizzer, I
> made up to 550mj/cm2 of exposure, and PEB 95C 12 min, it still didn't work.
> I don't know where the problem is.
>
> Thanks for your help
>
> --
> Tong Chen
> Postdoc
> SyntheCell Team
> IGDR CNRS UMR 6290
> 2, Avenue du Professeur Léon Bernard
> 35043 Rennes
> France
>
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