Hi Michael, Your problem might be the exposure dose. If you are using the same time for glass and silicon for exposure, you might be under exposing the photoresist because of the reflectivity difference in the two substrates. This might make the photoresist dissolve more slowly and, thereby, reduce the apparent undercut rate for the LOR. -Lou > From: michael.martin@louisville.edu > To: mems-talk@memsnet.org > Date: Mon, 26 Aug 2013 16:32:40 +0000 > Subject: [mems-talk] LOR 3A and Borosilicate > > Hi, > Does anyone have experience with LOR3A (w/ 1827) on borosilicate glass. The processing parameters, i.e. undercut rate after a 6 min 150C bake, appear quite different than those for silicon. That is, I am seeing a much lower undercut rate for the borosilicate than for silicon. > > Thank you, > Michael > _______________________________________________ > Hosted by the MEMS and Nanotechnology Exchange, the country's leading > provider of MEMS and Nanotechnology design and fabrication services. > Visit us at http://www.mems-exchange.org > > Want to advertise to this community? See http://www.memsnet.org > > To unsubscribe: > http://mail.mems-exchange.org/mailman/listinfo/mems-talk _______________________________________________ Hosted by the MEMS and Nanotechnology Exchange, the country's leading provider of MEMS and Nanotechnology design and fabrication services. Visit us at http://www.mems-exchange.org Want to advertise to this community? See http://www.memsnet.org To unsubscribe: http://mail.mems-exchange.org/mailman/listinfo/mems-talk