Hello Ricky,



the standard photoresist are not optimized for copper surfaces (except the
PCB resists). I would recommend the usage of an adhesion promoter like
TI-Prime (microchemicals, Ulm, Germany). The other problem of staining of
the copper has its reason in the “metal-ion-free” TMAH – tetramethyl
ammonium hydroxide as the main component of your developer. This substance
is able to attack slightly the copper under forming a complex. A KOH-based
developer would work much better.





Best regards/Mit freundlichem Gruß



André Bödecker



Institut für Mikrosensoren, -aktoren und -systeme

Universität Bremen Fachbereich 1

Otto-Hahn-Allee1

28359 Bremen

Tel: 0421 218 62596



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