Hi All,

I was working on thick AZ9260 resist for using as a mask on DRIE tool.
My target is to etch 450-480 um of Silicon. I have preliminary results for
PR:Si selectivity, which is ~1:25. To etch 450 um of Si, I would need at
least 18 um(but more the better) of AZ9260. With single coating I am
getting maximum of 15 um. But when I do double spinning and expose it, the
resist is turning yellowish-orange. Further, I develope it, but when I put
it inside the DRIE tool, after a few cycles, the resist is forming flakes
and contaminating inside the chamber.

Here is my recipe:
-2000 rpm - 60 s
-removing edge bead with Acetone, while spinning.
-Soft bake at 110 C for 90 s
-2000 rpm - 60 s
-Soft bake at 110 C for 240 s.

-Exposure, broadband source,950 mJ/cm2.
-Developer, AZ400:DI 4:1, 3-4 mins.
With this recipe, I am getting ~25 um. but when I put it inside DRIE,the
resist is just peeling of and forming flakes.

Can you please advise if there is something I am missing?
Also, any recipe would be much appreciated.

kind regards,
Ajymurat
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