durusmail: mems-talk: AZ9260 double spinning recipe
AZ9260 double spinning recipe
2013-10-03
Orozaliev Ajymurat Nurdinovich
2013-10-03
basar bolukbas
2013-10-03
Jonathan Lueke
2013-10-06
Orozaliev Ajymurat Nurdinovich
2013-10-03
Gary Hillman
2013-10-04
Alex Feldman
2013-10-04
Ioannis Nikolaou
2013-10-04
Orozaliev Ajymurat Nurdinovich
2013-10-06
Ioannis Nikolaou
AZ9260 double spinning recipe
basar bolukbas
2013-10-03
Dear Ajymurat,

You can find some details even 24um thick process with AZ9260 in these links
below:

http://www.nanofab.utah.edu/svn/public/documents/Non%20SOPs/Photoresist/az_9260_
photoresist.pdf

http://microchemicals.com/micro/az_9200.pdf

I hope this can help you.Regards.

---

> Date: Thu, 3 Oct 2013 11:30:21 +0400
> From: ajymurat@gmail.com
> To: mems-talk@memsnet.org
> Subject: [mems-talk] AZ9260 double spinning recipe
>
> Hi All,
>
> I was working on thick AZ9260 resist for using as a mask on DRIE tool.
> My target is to etch 450-480 um of Silicon. I have preliminary results for
> PR:Si selectivity, which is ~1:25. To etch 450 um of Si, I would need at
> least 18 um(but more the better) of AZ9260. With single coating I am
> getting maximum of 15 um. But when I do double spinning and expose it, the
> resist is turning yellowish-orange. Further, I develope it, but when I put
> it inside the DRIE tool, after a few cycles, the resist is forming flakes
> and contaminating inside the chamber.
>
> Here is my recipe:
> -2000 rpm - 60 s
> -removing edge bead with Acetone, while spinning.
> -Soft bake at 110 C for 90 s
> -2000 rpm - 60 s
> -Soft bake at 110 C for 240 s.
>
> -Exposure, broadband source,950 mJ/cm2.
> -Developer, AZ400:DI 4:1, 3-4 mins.
> With this recipe, I am getting ~25 um. but when I put it inside DRIE,the
> resist is just peeling of and forming flakes.
>
> Can you please advise if there is something I am missing?
> Also, any recipe would be much appreciated.
>
> kind regards,
> Ajymurat
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