Are you using the adhesion promoter before you apply AZ9260?


On Thu, Oct 3, 2013 at 3:30 AM, Orozaliev Ajymurat Nurdinovich <
ajymurat@gmail.com> wrote:

> Hi All,
>
> I was working on thick AZ9260 resist for using as a mask on DRIE tool.
> My target is to etch 450-480 um of Silicon. I have preliminary results for
> PR:Si selectivity, which is ~1:25. To etch 450 um of Si, I would need at
> least 18 um(but more the better) of AZ9260. With single coating I am
> getting maximum of 15 um. But when I do double spinning and expose it, the
> resist is turning yellowish-orange. Further, I develope it, but when I put
> it inside the DRIE tool, after a few cycles, the resist is forming flakes
> and contaminating inside the chamber.
>
> Here is my recipe:
> -2000 rpm - 60 s
> -removing edge bead with Acetone, while spinning.
> -Soft bake at 110 C for 90 s
> -2000 rpm - 60 s
> -Soft bake at 110 C for 240 s.
>
> -Exposure, broadband source,950 mJ/cm2.
> -Developer, AZ400:DI 4:1, 3-4 mins.
> With this recipe, I am getting ~25 um. but when I put it inside DRIE,the
> resist is just peeling of and forming flakes.
>
> Can you please advise if there is something I am missing?
> Also, any recipe would be much appreciated.
>
> kind regards,
> Ajymurat
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