1. Rehydration varied from 30 mins to 20 hours, at 73 % RH.
2.Longest soft bake was 5 mins.


On Thu, Oct 3, 2013 at 7:08 PM, Jonathan Lueke  wrote:

> I use AZ4620 for a similar etch. 2 layers. About 25-26um.
>
> Two questions:
>
> 1. Do you allow for a full rehydrate between depositions of resist?
>
> 2. Have you tried a longer hard bake? 10-15 min?
>
> Our processes are very similar except those two steps.
>
> Jon
>
> ----------------------------
> Jonathan Lueke B.Sc., E.I.T.
> Ph.D. Candidate
> Department of Mechanical Engineering
> University of Alberta
> (780)6906468
>
> Sent from my iPhone
>
> On 2013-10-03, at 1:30 AM, Orozaliev Ajymurat Nurdinovich <
> ajymurat@gmail.com> wrote:
>
> > Hi All,
> >
> > I was working on thick AZ9260 resist for using as a mask on DRIE tool.
> > My target is to etch 450-480 um of Silicon. I have preliminary results
> for
> > PR:Si selectivity, which is ~1:25. To etch 450 um of Si, I would need at
> > least 18 um(but more the better) of AZ9260. With single coating I am
> > getting maximum of 15 um. But when I do double spinning and expose it,
> the
> > resist is turning yellowish-orange. Further, I develope it, but when I
> put
> > it inside the DRIE tool, after a few cycles, the resist is forming flakes
> > and contaminating inside the chamber.
> >
> > Here is my recipe:
> > -2000 rpm - 60 s
> > -removing edge bead with Acetone, while spinning.
> > -Soft bake at 110 C for 90 s
> > -2000 rpm - 60 s
> > -Soft bake at 110 C for 240 s.
> >
> > -Exposure, broadband source,950 mJ/cm2.
> > -Developer, AZ400:DI 4:1, 3-4 mins.
> > With this recipe, I am getting ~25 um. but when I put it inside DRIE,the
> > resist is just peeling of and forming flakes.
> >
> > Can you please advise if there is something I am missing?
> > Also, any recipe would be much appreciated.
> >
> > kind regards,
> > Ajymurat
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