Hi All,

I have recently trying to develop a resist for equal thickness on two different
substrates (NIfE AND Cu coated). Even though the same process has been used for
both, the development time for NiFe is two times higher than that with Cu. Any
reasons?

Many Thanks,

Ricky Anthony
Phd Student

Microsystems Center
Tyndall National Institute
University College Cork
Cork, IRELAND

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