Hi Friends, Actually, I want to state a little bit more on the meshing issue of my current study using Solid226. The problem I have is the Ansys program simply crashes when I try to solve. I searched online and somebody says the 14.5 versions are not really stable. But I think it might be the problem with the meshing. I wonder whether Daniel or anyone else has come into this problem before. Thanks. On Mon, Nov 4, 2013 at 11:54 AM, Youmin Wangwrote: > Hi Daniel, > > > Thank you for you kind help! > > After investigations done so far, I recognized that Trans126 element might > not be a good choice to be used in my tilting mirror applications. Though > the Ansys help manual indicated something as below: > > [image: Inline image 1] > > As you can see, the above figure is using Trans126 elements, though I > think it is a simplified model. I heard that Trans126 is good for > attraction, while difficult to perform the leaving electrodes. Beyond that. > I think my micromirror has more complicated geometry than the parallel > plates, I don't know this parallel-plate simplification would be a good > choice for it. > > As for now, I am considering to proceed with the Solid226 option, which is > exactly what you have suggested. I am trying to mesh the air gap between > the movable mirror and the fixed electrodes using Solid226 elements, while > leaving the other parts using Solid45. The electroelastic and structural > elements are joined through nodal connectivity at the interface between > them. I am still working on this direction right now, when the geometry > becomes more complicated, seems it get more difficult to converge, I have > many small parts to trim, such as the meshing and boundary conditions... > > Another option seems to be multi-field solver, which up-to-now I have not > acquired too much reference materials and did not dive in too deep yet. > > Again, thank you very much for your help and suggestions! I am really > grateful to you. If you could provide more insight, that would be really > great. > > > On Fri, Nov 1, 2013 at 11:22 AM, Daniel Shaw wrote: > >> Hi Youmin: >> >> >> >> To perform an electrostatic-structural simulation using Mechanical APDL >> (aka “classic ANSYS”), you can use either the 22x coupled-field elements, >> the multi-field solver (MFS), or the electro-mechanical transducer element >> (TRANS126). You could also use the reduced order electrostatic-structural >> element (ROM144). The 22x elements and the MFS use a sequential coupling >> approach. TRANS126 and ROM144 use a matrix coupling approach. >> >> >> >> If possible, I recommend using TRANS126. It is the simplest and most >> robust approach. With the 22x elements and the MFS, you might have >> meshing >> issues at pull-down. ROM144 can be complicated to implement. If fringing >> effects are significant, TRANS126 might be difficult to accurately >> implement. In that case, you need to use one of the other methods. >> >> >> >> Regards, >> >> >> >> Daniel Shaw >> >> ANSYS, Inc. >> >> >> >> On Wed, Oct 30, 2013 at 9:50 PM, Youmin Wang > >wrote: >> >> > Dear Friends, >> > >> > I am starting to use Ansys for the modeling of MEMS micromirror >> > static/dynamic analysis. There have been many previous work in this >> field, >> > but according to my observations, 3 key technologies were basically used >> > for MEMS electromechanical coupling, which are 1. using Coupled Field >> > Element (SOLID226); 2. Multi-field solver; and 3. Trans126. >> > >> > Seems for method #1 I have to use air to enclose the whole device if >> fringe >> > electric field needs to be considered, but in "Gyimesi, Miklos, Ilya >> > Avdeev, and Dale Ostergaard. "Finite-element simulation of >> > micro-electromechanical systems (MEMS) by strongly coupled >> > electromechanical transducers." Magnetics, IEEE Transactions on 40.2 >> > (2004): 557-560." it says in large deformation bending electrode >> problem, >> > Trans126 might not be suitable. >> > >> > Do you guys have any previous experience on this selection issue? >> Besides, >> > seems Trans126 also requires the pre-stress definition, which I am still >> > struggling to find out where to apply... >> > _______________________________________________ >> > Hosted by the MEMS and Nanotechnology Exchange, the country's leading >> > provider of MEMS and Nanotechnology design and fabrication services. >> > Visit us at http://www.mems-exchange.org >> > >> > Want to advertise to this community? See http://www.memsnet.org >> > >> > To unsubscribe: >> > http://mail.mems-exchange.org/mailman/listinfo/mems-talk >> > >> _______________________________________________ >> Hosted by the MEMS and Nanotechnology Exchange, the country's leading >> provider of MEMS and Nanotechnology design and fabrication services. >> Visit us at http://www.mems-exchange.org >> >> Want to advertise to this community? See http://www.memsnet.org >> >> To unsubscribe: >> http://mail.mems-exchange.org/mailman/listinfo/mems-talk >> > >
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