I am trying to build a vacuum chuck for spinning, and can't figure out
if a common laboratory roughing vacuum pump would break a silicon
wafer. There is some distance from the center of the chuck to the
O-ring(s), but how much? And the vacuum will never apply more than
14.7 PSI (at sea level), right?

This mentions silicon surviving >10000 PSI, but is that an ingot or
rod or wafer, I can't tell.
http://www.me.berkeley.edu/~lwlin/me119/papers/paper9.pdf

--
-Nathan
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