Hello Abhinav,

Have you considered SU8? This is a resin-like negative photoresist that
after cured is a very good maks for several process. It can be removed by
RIE or piranha. Check MicroChem (http://www.microchem.com/) website for
more info. I hope it helps.

Daniel.


On Tue, Jan 21, 2014 at 2:27 PM, Abhinav Jain wrote:

> Hello all!
>
> I am using PDMS to protect one side of the wafer during 8 hour KOH etch at
> 85C. I am using Sylgard 170.
>
> I am having problems having a clean surface after wet-etching of PDMS. I am
> using Dynasolve 217, but its not dissolving it completely (even after hours
> of dipping in solution). I am even using Q-tip sometimes to remove PDMS in
> the Dynasolve solution. There is always this white residue/layer left.
>
> 1. Am I missing something? Is there a better way to wet etch PDMS? How
> about TBAF and NMP mixture? Is this more efficient than Dynasolve to remove
> the residual PDMS?
>
> 2. Is there an inexpensive and quick way to protect the other side of the
> wafer? (Other than protek and parylene coating. I am looking for something
> which is easy to coat and easy to remove). How about Apezion W wax? Is it
> stable at 85C?  How do you apply solid wax to the whole wafer?
>
> (There is LPCVD silicon nitride film on the other-side but there are always
> some pinholes and defects and it cant stand 8 hour etch.)
>
> I would really appreciate the inputs.
>
> Thanks
> Abhinav Jain
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--


*Daniel VercosaPhD StudentApplied Physics*
*Rice University*
*www.robinsonlab.com* 
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