I used to use a phase contrast microscope to align layers. Once I found the alignment marks under the microscope, I would manually scratch the resist with a scalpel (which needs a steady hand). Then I could align the second layer to the scratches on the mask aligner. On 14 May 2014 17:14, Bill Chowwrote: > Dear all, > > Recently, I am working on a two layer SU-8 structure. All the process are > followed with the suggested procedures. However, the problem appeared when > I try to look for the alignment mark, after I have spin coated and prebaked > the second layer of SU-8, it is difficult to locate the first layer exposed > features. > > First layer thickness : 3.7um > Second layer thickness : 17 - 20um > > I found that it is extremely difficult to locate the first layer pattern > under the microscope after I have coated the second layer, despite it can > be seen be naked eye.... Sometimes if there are some defect or bump in the > 2nd layer above the alignment mark, then it can be seen clearly. However, > it is a random process and will affect my pattern. Are there any ways to > improve the visiblity of the alignment mark after I have coated the 2nd > layer? Thanks. > > Regards, > > Bill > > _______________________________________________ > Hosted by the MEMS and Nanotechnology Exchange, the country's leading > provider of MEMS and Nanotechnology design and fabrication services. > Visit us at http://www.mems-exchange.org > > Want to advertise to this community? See http://www.memsnet.org > > To unsubscribe: > http://mail.mems-exchange.org/mailman/listinfo/mems-talk > _______________________________________________ Hosted by the MEMS and Nanotechnology Exchange, the country's leading provider of MEMS and Nanotechnology design and fabrication services. Visit us at http://www.mems-exchange.org Want to advertise to this community? See http://www.memsnet.org To unsubscribe: http://mail.mems-exchange.org/mailman/listinfo/mems-talk