Hi Sebastian,
I've seen similar problem with RIE and I think you can try to glue your
wafer, to prevent it overheating.

Best,

Sophie


Postdoc, Stanford University
Energy Resources Engineering Department





2014-07-23 8:00 GMT-07:00 Sebastian R Freeman :

> Hi everyone,
>
> I am etching a 4-inch silicon wafer in the RIE using O2, and CF4, in
> combination. Using positive photoresist, my goal is to create an array of
> silicon pillars covering the surface of the wafer. I am trying to push the
> limits of the machine, and trying to etch several microns. I etched for 5
> minutes and was able to get 1.5 micron tall pillars, the wafer came out of
> the machine very dirty, with a film-like residue on it, and looking very
> scratched up. I think I might have an idea of what this is, but I would
> appreciate anyone else's input, or a way to prevent it.
>
> *Sebastian Freeman*
> *Ph.D Student*
>
> *Binghamton University *
>
> *Thomas J. Watson School of Engineering*
> *Department of Bioengineering*
> *Office: Biotechnology Building 2629*
> *E-mail: sfreema1@binghamton.edu *
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