Thank you to Sangeeth and Gabriel, I found out the problem was with the DI water bath after development. I changed it to a 10s IPA rinse and all of my issues were fixed. Kyle On Nov 11, 2014, at 22:49, sangeeth kallattwrote: > Hi Kyle, > I think PMMA is underdeveloped in these images. You may want to try out few > things. > > 1. Make sure that you are exposing PMMA with required dose. If you are > using 100kV, apply 800uC or more. > 2. PMMA A6 would be really thick. It requires more time to develop in > 1:3 solution > 3. Pre-bake for more time. say, 5 min on hot plate. > > If these things are not working, then you can suspect PMMA/developer. I > don't think PMMA can redeposit after development. > > Regards, > > Sangeeth > > On Fri, Nov 7, 2014 at 3:49 AM, Kyle Godin wrote: > >> Hello. This fall I have been having trouble with my PMMA EBL processing. >> After development, the patterns are filled in randomly and also there are >> waves of PMMA deposited with macroscale features in-plane. I believe the >> issue is developed PMMA redepositing everywhere. I found some hints online >> about PMMA redepositing or scumming, but nothing to suggest a solution for >> me. I cannot figure out why this is happening as my process has been the >> same for two years and never had this issue until recently. Please see two >> photos: >> >> >> https://www.dropbox.com/s/rpmuv6heh9zfauj/ebl%20scum%20image%20width%201mm.jp g?dl=0 >> >> https://www.dropbox.com/s/wl3jgpo3tc66d5b/ebl%20scum%20image%20width%202mm.jp g?dl=0 >> >> I tried getting new resist from the main bottle, used different resists, >> inspected the resist optically before exposure and there is no thickness >> variation, have tried “developing” unexposed resist and optically >> everything looked fine. >> >> Process: >> SiO2 on Si, thickness 90nm or 300nm or 1um. >> PMMA 950 A4 or 950 A6. >> Spin 3k 30s, bake 180C hot plate for 60s. >> Sometimes I expose right away, sometimes the chips rest overnight - same >> results. >> Exposure is with a Jeol6300 at 2nA. >> Development is MIBK:IPA 1:3 for 55s. >> Then dunk in a large bath of DI water to quench development. >> >> Thanks, >> Kyle Godin >> kgodin@stevens.edu >> >> _______________________________________________ >> Hosted by the MEMS and Nanotechnology Exchange, the country's leading >> provider of MEMS and Nanotechnology design and fabrication services. >> Visit us at http://www.mems-exchange.org >> >> Want to advertise to this community? See http://www.memsnet.org >> >> To unsubscribe: >> http://mail.mems-exchange.org/mailman/listinfo/mems-talk >> > > > > -- > > > > > *Sangeeth KCenter for Nano Science and Engineering (CeNSE)Department of > Electrical Communication EngineeringIndian Institute of ScienceBangalore-12* > _______________________________________________ > Hosted by the MEMS and Nanotechnology Exchange, the country's leading > provider of MEMS and Nanotechnology design and fabrication services. > Visit us at http://www.mems-exchange.org > > Want to advertise to this community? See http://www.memsnet.org > > To unsubscribe: > http://mail.mems-exchange.org/mailman/listinfo/mems-talk _______________________________________________ Hosted by the MEMS and Nanotechnology Exchange, the country's leading provider of MEMS and Nanotechnology design and fabrication services. Visit us at http://www.mems-exchange.org Want to advertise to this community? See http://www.memsnet.org To unsubscribe: http://mail.mems-exchange.org/mailman/listinfo/mems-talk