Hi everyone,
For my experimental setup, I need to fabricate microchannels on Silicon
wafer. I have a number of chips designed on the 4 inch silicon wafer with
different aspect ratios of micrchannels. After using lithography and
etching, I need to seal the chips. From the literature I found, usually
anodic bonding is used to seal the wafer with glass. I looked up the
facilities around my university and none of them has the anodic bonding.
Therefore, I have to perform the process myself.
As I am not familiar with the process, I have some questions:
1) If I do the process and bond the silicon wafer to glass wafer, is it
possible that I use dicing to cut the wafer into my desired dimensions and
into my chips?
2)From the sources I found about the anodic bonding setup, it seems it
needs to be done in clean room. Do you know if it's necessary or not?
I would be thankful if you share your knowledge with me about the process.
Leily
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