We found the developer concentration and temperature to be important but the
most important factor was the first and second exposure intensity. Bill

Sent from my iPad

> On Jul 14, 2015, at 6:33 AM, André Bödecker 
wrote:
>
> We had also problems while using an automatic developing device. The
> undercut depends among other things on the abrasive effect of the spraying
> direction of the developer tool. We made better experience with manual
> developing in a petri dish and always using fresh developer.
>
> André
>
> -----Ursprüngliche Nachricht-----
> Von: mems-talk-bounces+aboedecker=imsas.uni-bremen.de@memsnet.org
> [mailto:mems-talk-bounces+aboedecker=imsas.uni-bremen.de@memsnet.org] Im
> Auftrag von Joshua Wells
> Gesendet: Freitag, 10. Juli 2015 13:43
> An: mems-talk@memsnet.org
> Betreff: [mems-talk] Liftoff Process Using LOR 10B and 1800 Series Resist
>
> I am trying to develop a repeatable liftoff process using LOR10B and an
> 1800 series positive resist for use with 1:1 microdev developer (necessary
> for material compatibility). The trouble arises in the repeatability of the
> process. Time of development varies significantly between runs with no
> process parameters changing yielding far too much undercut for our
> application. We have the LOR thinner and have by trying to work with that as
> well as full thickness LOR.
>
> Does anyone have a repeatable process or suggestions?
>
>
> Joshua
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