Hi John,

For the size of the substrate you are using it seems that traditional
methods might be difficult.
I would suggest instead of applying usual methods to deposit the metal film
by electroless plating.
This will require to dip the substrate into a bath of chemicals without
fancy equipment.
You may implement this as liftoff or etch thru  but I think that etch thru
will be better.
There are many electroless formulations and you can find the appropriated
for you.

For the mask, you may use a dry film photoresist. This is PHR that can be
laminated. Here too, there are many variations and you can find the one that
most suits you. If the basic resolution of the dry resists is not as you
need, you ay combine several implementations to go down to the required
design rules.

As for the mask, you can go to a printing shop and ask to print you the
required mask on a transparency. you may design a big layout and they can
shrink it to the required final dimensions.

For the exposure as well you can find an available simple source.

I hope it is of some help to you and I am curious how eventually you perform
your process.


Igal




-----Original Message-----
From: mems-talk-bounces+igalch=ieee.org@memsnet.org
[mailto:mems-talk-bounces+igalch=ieee.org@memsnet.org] On Behalf Of John
Bohland
Sent: Wednesday, June 29, 2016 3:57 AM
To: mems-talk@memsnet.org
Subject: [mems-talk] How to make a metal grid

I am interested in making a metal grid on a 370 mm X 470 mm glass substrate.

The problem is that the metallization lines must be only 1.5 microns in
width and spaced (pitch) only a few microns apart.

The metal can be Al or Ag and 100 nm thick.

The best idea I have is to monolithically coat the glass with sputtered
(PVD) Al or Ag then use a picoseond laser to remove all but the desired 1.5
micron wide metal line widths. Even then I don't know if the laser would
have good enough resolution to meet these requirements.

Anyone have better ideas?

Thanks,

John

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