durusmail: mems-talk: Problem with SU-8 Thick film
Problem with SU-8 Thick film
***SPAM*** Problem with SU-8 Thick film
2017-09-28
2017-10-02
2017-10-06
Problem with SU-8 Thick film
PlayDoh/Unboxing SurpriseEggs/SuperHeros/Joy
2017-09-28
use a smaller atom sized layers before.


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*James Guenes*
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On Thu, Jun 22, 2017 at 7:31 AM, Sunshine Littlecreek <
sunshine.littlecreek@gmail.com> wrote:

> Hello,
> I’m working with SU-8 2025 and 2075, 100 um - 500 um thick on top of gold.
> My features are 20 um - 300 um wide. When I try to electroplate the
> features, some of them don’t plate. Here’s my process: Clean substrates
> (acetone, IPA, diH20 10 minutes each), dehydrate for 30 min.  Spin Omnicoat
> at 3000 rpm, bake for 1 min at 200 C. Spin SU-8 at 1000 rpm, soft bake for
> 7 min at 65 C, ramp to 95 C, bake for 20 min (thinner films)-45 min
> (thickest films). Expose  with UV 3 cycles of 270 mJ/cm^2 and post exposure
> bake : 5 min at 65 C, 15 min at 95 C up to 25 min for thickest films.
> Development is done using MicroChem SU8 Developer on a shaker plate
> (usually about an hour). When I rinse with IPA and diH20, no white haze
> forms, so it should be fully developed. Omnicoat gets developed in an O2
> plasma chamber at 100 W.
>
> I’ve looked around the web, and tried some of the suggestions like using a
> sonicator (developed features quickly, but resulted in sheets of SU8 coming
> off taking features with it), rinsing more frequently, and eliminating the
> PEB (SU8 dissolved in developer), but I haven’t had better outcomes.
>
> I do a visual inspection using a stereoscope to check if the bottom looks
> clean, which it usually does.  However, when I electroplate, not all of the
> features plate or plate evenly. I’ve gone from having no plating at all
> (resulted in higher exposure and longer development times being used) to
> partial plating. I need to get all my features to consistently plate across
> all features. Any ideas or suggestions would be greatly appreciated.
>
> Thank you,
> Sunshine Littlecreek
>
>
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