All surfaces have very tiny holes, which allow very tiny air-balloons to
get embedded in them.


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On Fri, Sep 29, 2017 at 1:32 AM, Rugved Likhite 
wrote:

> Hello,
>
> I have had a similar problem while electroplating copper. This usually
> happens due to small air bubbles forming on your high aspect ratio features
> which act as masks against electroplating. The bubbles are formed when you
> immerse a dry wafer into the electroplating solution.
>
> I was able to solve this my doing a DI water rinse on my wafer prior to
> electroplating. Wet the wafer, and immerse the wet wafer into the
> electroplating bath without letting the water dry. This prevented the
> micro-air bubbles and gave me consistent electroplating across the wafer.
>
> Thanks,
> Rugved
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