Mehmet,
We used to evaporate SiO2 a few decades ago (in the 1980’s). Our layers were
only about 2000Å, which is a far cry from 6 µm, and the main problem was that
the material was highly stressed and tended to flake off the walls of the
evaporator after only a couple of runs. I couldn’t cite any mechanical
properties at this point. Perhaps heating the substrate could help to dial in
the stress but it was not an option for us. We ultimately abandoned it to a
plasma deposition process of Si3N4.
_________________________________

Brad Cantos
brad.cantos@holage.com
http://holage.com




> On 1 Jun 2018, at 1:00 AM, Mehmet Yilmaz  wrote:
>
> Dear mems-talk community,
> We are interested in e-beam evaporation of thick layers (from 6 microns up
> to 16 microns) of SiO2.
> We wonder if anybody from the mems-talk community have any experience with
> such thick layers of SiO2 e-beam evaporation in terms of mechanical
> properties such as Young's modulus and residual stress?
>
> Based on the feedback from the mems-talk community we may decide to proceed
> directly with our actual work, or do some preliminary experiments before we
> start our actual work.
>
> Sincerely,
>
> Mehmet
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