Hi,
Does anyone of the list members employ an Electronic Visions anodic
bonder EV 500?
We are thinking about building a point electrode for our machine but
would prefer to use an existing construction.
The electrode should apply voltage to a point in the center of the
wafer and apply pressure evenly over the whole wafer surface.
Yours sincerely, Kai Hiltmann

mailto:Kai.Hiltmann@HSG-IMIT.de    http://www.HSG-IMIT.de
K. Hiltmann; HSG-IMIT; Sensorics Section
W.-Schickard-Str. 10; D-78052 Villingen-Schwenningen
Phone ++49-7721-943-132; Fax ++49-7721-943-210