SYMPOSIUM ON: MICROMACHINING AND MICROFABRICATION '95
AUSTIN, TX 23-24 OCTOBER 1995
AUSTIN MARRIOTT AT THE CAPITOL
Sponsored by SPIE and SEMI
Co-located with SPIE's Microelectronic
Manufacturing '95
25-27 October 1995
SYMPOSIUM CHAIR: JAMES W. KNUTTI, Silicon Microstructures Inc.
SYMPOSIUM CO-CHAIR: LARRY HORNBECK, Texas Instruments
Microlithography and Metrology in Micromachining
Conference Chair: Michael T. Postek, National Institute of Standards and
Technology.
Program Committee:
Michael Gaitan, National Institute of Standards and Technology; Liang Y. Chen,
Cornell Univ.; Craig Friedrich, Louisiana Tech Univ.; Joel Kubby, Xerox; Janet
Marshall, National Institute of Standards and Technology; Kristofer Pister,
Univ. of California/Los Angeles; Vance Tyree, MOSIS; Laurie Lauchlan, IBM
AdStar
Microelectromechanical systems (MEMS) are micrometer to millimeter scale
devices utilized in a growing number of applications such as micromotors,
actuators, sensors, heat exchangers and filters. As the dynamically changing
MEMS technology base expands, new and even more exciting applications are on
the horizon. Current studies indicate that MEMS will grow to a $14 billion/year
industry by the turn of the century. MEMS fabrication is rapidly evolving and
utilizes many of the microlithographic techniques currently in use by the
microelectronics industry. As new fabrication technologies emerge, new types of
devices become possible and new systems are being discovered. With these new
techniques also emerge needs for metrological techniques including test
structures, dimensional measurements and test methods to ensure MEMS
performance. This conference is intended to bring together the rapidly evolving
knowledge-base, expertise, tools and techniques that are being developed and
employed in MEMS technology.
Therefore, we are soliciting papers related, in general, to the
microlithographic fabrication and metrology of MEMS including the following
areas:
Microlithography Fabrication Techniques
optical/E-beam/Ion beam/X-ray/laser lithography
3-D microstructure fabrication, LIGA
multiple level device fabrication
rapid prototyping
rapid mask making
Lithography and Fabrication Issues
high aspect ratio definition
deep etching and thick film deposition
topography
lithography on non-planar surfaces
planar process/planarization of micromachines
special process
future device demands and integration with electronics
Metrology and Inspection
test structures
dimensional measurements
systems and tools
Micromachined Instruments and Mechanisms for Microscopy and Nanolithography
micromachined STM, AFM, and SEM tips novel techniques for forming
nanostructures new devices and applications:
microcolumns/probes
Materials
sensors and actuating materials
metals/semiconductors/insulators
resists
commercial resists/photosensitive polyimides
experimental resists (e.g., self-assembling monolayers)
stability of resist under high-flux sources
etch mask technology
Device and Systems Modeling
CAD tools
3D imaging for micromachines
process and performance models for high-aspect ratio
lithography
infrastructure needs for MEMS
CALL#2 Microelectronic Structures and Microelectromechanical Devices for
Optical Processing and Multimedia Applications
Conference Chairs:
Wayne Bailey, Texas Instruments Inc.; M. Edward Motamedi, Rockwell
International Corp.; Fang-Chen Luo, Optical Imaging Systems, Inc.
Program Committee:
Thomas J. Cloonan, AT&T Bell Labs.; Bruce Gnade, Texas Instruments Inc.;
Kristofer Pister, Univ. of California/Los Angeles; Ming Wu, University of
California/Los Angeles; Robert Leheny, ARPA
Rapid progress is being made in the emerging field of Microelectromechanical
Systems (MEMS). The potential merging of optical devices with micromechanics to
create a broader class of devices makes them highly alluring for many
commercial applications. Already, the technology has introduced such devices as
Digital Micromirror Devices (DMD) for projection display and incorporated
liquid crystal displays (LCD) for communications, entertainment, automobiles,
and machine tools-all of which, in some way, requires optical switching and
light modulation.
Communications, computers and entertainment will begin to merge into a single
entity where the vehicle for entering the information superhighway will include
optical switches and light modulation applications. The current technologies
have been driven with applications which are silicon based and use standard
CMOS processing fabrication steps not only for the on-die CMOS memory or logic
but also for the microfabrication of the light- switching devices. This enables
the use of existing fabs and process techniques for their production.
This conference is intended to bring together both the device fabrication and
total system design for the various competing technologies. The focus will be
on microstructures and processes necessary for the production of Digital
Micromirror Devices (DMDs), Field Emission Devices (FEDs), and Liquid Crystal
Displays (LCDs), along with issues which drive high resolution CRTs.
The topics for this conference include but are not limited to:
Fabrication and process issues involving:
CMOS and MEMS, DMD, or LCD devices.
CRT electron optics, black matrix, shadow masks, and phosphor deposition.
DC plasma displays (PDP).
Field Emission Displays (FED)
device packaging issues
Characterization:
reduction of surface effects on device operation.
electrostatic interactions.
color, brightness and contrast ratio.
defects and device lifetime.
System Design:
direct view and projection display capabilities.
digital computer and HDTV systems.
printer applications.
CALL #3 Micromachining and Microfabrication Process Technology
Conference Chair:
Karen Markus, MCNC
Program Commitee:
Henry Guckel, Univ. of Wisconsin/Madison; Jerome Sohn, The Charles Stark Draper
Lab.; Mehran Mehregany, Case Western Reserve Univ.; S. Pang, Univ. of Michigan;
Stephen J. Fonash, The Pennsylvania State Univ.
Microelectromechanical Systems is a rapidly growing field projected to reach a
$14B market by the year 2000. MEMS brings together researchers from
multidisciplinary backgrounds and builds on the fabrication and manufacturing
technologies that have been initiated in both the VLSI and precision
engineering fields. Modification of existing process methodologies, as well as
novel processes are revolutionizing the way microsystems are being produced.
This conference is intended to bring together the process developers and
integrators, device researchers and manufacturing engineers interested in the
present and future of MEMS process technologies. The focus will be new
applications of existing process technology, novel processes, and
manufacturing-driven process development.
The topics for this conference include, but are not limited to:
Integrated Processes
bulk silicon micromachining
surface micromachining
polysilicon
metals and polymers
LIGA, including micromolding
other non-lithographic micromachining
Unit Processes
dry etching
isotropic and non-isotropic processes
low-stress films
lithography issues unique to MEMS
high depth of focus, topography
fine-line thick resist
chemical processes
Manufacturing Issues for MEMS
cleaning, dicing, and packaging processes and issues
assembly
large-scale devices
Materials Issues
characterization of MEMS materials
test structures for MEMS
novel materials
CALL #4 Micromachined Devices and Components
Conference Chairs:
Ray Roop, Motorola; Kevin Chau, Analog Devices
Program Committee:
Leslie A. Field, Hewlett-Packard Co.; Robert J. Zeto, Army Reserach Lab.;
Khalil Najafi, Carlos Mastrangelo, Univ. of Michigan; Vijay K. Varadan, The
Pennsylvania State Univ.; Steve Terry, EG&G IC Sensors
The synergy provided by low microprocessor costs and application of silicon
wafer fabrication techniques to sensor devices has driven a proliferation of
micromachined devices and components for automotive, medical, and industrial
system applications. Accelerometers and pressure sensors have been established
in the market place and are undergoing evolution to higher functionality and
integration and lower cost. Other devices such as micromachined actuators and
micropumps have been demonstrated but have not yet found large scale commercial
application. For example, the application of micromachining to chemical sensors
has been investigated as a means to produce miniature chemical laboratories on
a chip. It is expected that micromechanical devices and components will enable
new products and applications, further increasing interest in this area.
Papers are solicited on topics dealing with micromachined devices and
components, including the following areas:
* pressure sensors
* accelerometers
* rate sensors
* micro-relays and actuators
* micro-valves
* micro-pumps
* flow sensors
* integrated devices
* multi-device platforms
* micro-mechanical springs, bearings, gears, and connectors
* micro-motors
* chemical sensors
* magnetic sensors
* packaging technologies for MEMS
* modeling and CAD for MEMS
* testing and characterization of devices
* reliability of micro-mechanical components
SUBMISSION OF ABSTRACTS
Abstract Due Date: 27 March 1995
Send abstract via e-mail in ASCII format to: abstracts@spie.org
or fax one copy to SPIE at 360/647-1445
or mail four copies to:
Micromachining and Microfabrication '95
SPIE, P.O. Box 10, Bellingham, WA 98227-0010 USA
Shipping address: 1000 20th St., Bellingham, WA 98225 USA
Telephone 360/676-3290
Conditions for Acceptance
- Authors are expected to secure registration fees, travel, and accommodation
funding, independent of SPIE, through their sponsoring organizations before
submitting abstracts. (See Chair/Author Benefits below.)
- Only original material should be submitted.
- Commercial papers, descriptions of papers, with no research content, and
papers where supporting data or a technical description cannot be given for
proprietary reasons will not be accepted for presentation in this symposium.
- Abstracts should contain enough detail to clearly convey the approach and the
results of the research.
- Government and company clearance to present and publish should be final at
the time of submittal.
- Applicants will be notified of acceptance by 7 July 1995.
Paper Review
To assure a high quality conference, all abstracts and Proceedings papers will
be reviewed by the Conference Chairs for technical merit and content.
Proceedings
The meetings will result in published Proceedings that can be ordered through
the Advance Program. Manuscripts are required of all accepted applicants and
must be submitted in English by 31 July 1995. Copyright to the manuscript is
expected to be released for publication in the conference Proceedings. Note: If
an author does not attend the meeting and make a presentation, the chair may
opt not to publish the author's manuscript in the conference proceedings.
Proceedings papers are indexed in leading scientific databases including
INSPEC, Compendex Plus, Physics Abstracts, Chemical Abstracts, International
Aerospace Abstracts, and Index to Scientific and Technical Proceedings.
Your abstract should include the following:
1. ABSTRACT TITLE
2. AUTHOR LISTING (principal author first) Full names and affiliations.
3. CORRESPONDENCE FOR EACH AUTHOR Mailing address, telephone, fax, and e-mail
address.
4. SUBMIT TO: (Conference Title) (Conference Chair) at Micromachining and
Microfabrication '95
5. PRESENTATION
Indicate your preference for "Oral Presentation" or "Poster Presentation."
Placement subject to chairs' discretion.
6. ABSTRACT TEXT (250 words).
7. KEYWORDS
8. BRIEF BIOGRAPHY (principal author only) 50 to 100 words.
Publishing Policy
Manuscript due dates must be strictly observed. Whether the Proceedings volume
will be published before or after the meeting, late manuscripts run the risk of
not being published. The objective of this policy is to better serve the
conference participants and the technical community at large. Your cooperation
in supporting this objective will be appreciated by all.
Chair/Author Benefits
Chairs/authors/co-authors are accorded a reduced-rate registration fee.
Included with fee payment are a copy of the Proceedings in which the
participant's role or paper appears, a complimentary one- year nonvoting
membership in SPIE (if never before a member), and other special benefits.
Poster Presentation
Interactive poster sessions will be scheduled. All conference chairs encourage
authors to contribute papers with technical content that lends itself well to
the poster format. Please indicate your preference on the abstract.
Oral Presentation
Each author is generally allowed 15 minutes plus a five-minute discussion
period. SPIE will provide the following media equipment free of charge: 35 mm
carousel slide projectors, overhead projectors, electric pointers, and video
equipment (please give at least two weeks advance notice).
SPIE's 1995 Symposium on Micromachining and Microfabrication '95
23-24 October 1995
Austin Marriott at the Capitol
Austin, Texas USA
** Abstract Due Date: 27 March 1995 **
** Manuscript Due Date: 31 July 1995 **
Proceedings of this conference will be published and available at the
symposium. The manuscript due date must be strictly observed.