Dear colleagues,

Now I am working on etching silicon wafer with KOH. I want to reduce the
thickness of silicon wafer to about 100 microns. But I found, after that
process
the surface of silicon became so worse that I could not continue my
work.

 Anyone can help me on  KOH etching techniques?
Thank you very much!

                                                              zhengwei

zw@itsvr.sim.ac.cn