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Hi, i have some problems and questionsabout SU-8 5 .
I ask you to help me to understand what's the problem we have with our
recipe.
Take in mind that we want obtain a layer of 20 microns of SU-8 5 on a
silicon substrate of 2" x 2" !
For the moment, this is the sequence we used:
- prewarm the substrate at 250C for 10min
- put the substrate in the spinner (wait for about 10 min to cool down)
- fill siringe with SU8-5 as it is from the bottle (about 2cc)
(already some small bubbles are visible)
- spin primer at 850rpm for 15s
- dip resist from the siring on the center of the substrate up to about
1cm. square
(bubbles are still present)
- push away bubbles from the center
- spin resist at 850rpm for 15s, with slow acceleration
(at this point of upper surface of the resist is already non uniform)
(i.e. mirrored imaged have a "wave" effect)
- bake subtrate on a hot plate at 60C for 2min
(some more bubbles are created, some disappear)
- bake at 90C for 5 min.
At the end we are not sure we have got a good uniform deposition .
It looks very thick and non uniform (we can not measure it for the
moment), but most evident is the "waving" effect on mirrored images.
The questions are:
1.Is there anything wrong woth our recipe?
2.Are we missing something?
3.what is the influence of substrate temperature on the photoresist
deposition?
In particular, after the warm of the substrate at 200 C , i must let it
to return
to ambient temperature and after depose the adhesion promoter or do it
at a different temperature?
4.what is the importance of the adhesion promoter in the process?
5.what are the ideal temperature and times of each phase (deposition ,
pre bake, patterning,post bake,
developing) of SU-8 5 process?
Thanks of all
--
Vanessa la Cecilia
Centro Integrazione Microsistemi
Parco Scientifico e Tecnologico d'Abruzzo
Via Antica Arischia 1
67100 L'AQUILA
ITALY
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Content-Type: text/html; charset=us-ascii
Content-Transfer-Encoding: 7bit
Hi, i have some problems and questionsabout SU-8 5 .
I ask you to help me to understand what's the problem we have with
our recipe.
Take in mind that we want obtain a layer of 20 microns of SU-8 5 on
a silicon substrate of 2" x 2" !
For the moment, this is the sequence we used:
- prewarm the substrate at 250C for 10min
- put the substrate in the spinner (wait for about 10 min to
cool down)
- fill siringe with SU8-5 as it is from the bottle (about 2cc)
(already some small bubbles are visible)
- spin primer at 850rpm for 15s
- dip resist from the siring on the center of the substrate up
to about
1cm. square
(bubbles are still present)
- push away bubbles from the center
- spin resist at 850rpm for 15s, with slow acceleration
(at this point of upper surface of the resist is already non
uniform)
(i.e. mirrored imaged have a "wave" effect)
- bake subtrate on a hot plate at 60C for 2min
(some more bubbles are created, some disappear)
- bake at 90C for 5 min.
At the end we are not sure we have got a good uniform deposition
.
It looks very thick and non uniform (we can not measure it for
the
moment), but most evident is the "waving" effect on mirrored
images.
The questions are:
1.Is there anything wrong woth our recipe?
2.Are we missing something?
3.what is the influence of substrate temperature on the photoresist
deposition?
In particular, after the warm of the substrate at 200 C , i must let
it to return
to ambient temperature and after depose the adhesion promoter
or do it at a different temperature?
4.what is the importance of the adhesion promoter in the process?
5.what are the ideal temperature and times of each phase (deposition
, pre bake, patterning,post bake,
developing) of SU-8 5 process?
Thanks of all
--
Vanessa la Cecilia
Centro Integrazione Microsistemi
Parco Scientifico e Tecnologico d'Abruzzo
Via Antica Arischia 1
67100 L'AQUILA
ITALY
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