I never baked for such a short time. I had baked it longer with long prebake.
Wrong soft bake sometimes causes cracks in the film after exposure. Such thick
films require a longer prebake.

Regards,

Padmaja

Padmaja Ramadas                                         (972)-927-1108 (w)
Texas Instruments Incorporated                  (972)-995-8787(fax)
Microcomponents Technology Center               ramadas@ti.com
Semiconductor Research & Development
P.O. Box 655012
M/S 945
Dallas, Texas  75265


> -----Original Message-----
> From: Jason Rim [SMTP:jasonr@aio.com]
> Sent: Monday, December 21, 1998 4:51 PM
> To:   MEMS@ISI.EDU
> Subject:      Microcracks on thick film
>
> Hellow,
> Anyone has comments or experience on microcracks of thick film ( 25 - 30
> micron single coated  AZ resist film ) after develop. It is really hard to
> find them before develop, or probably there no microcrack before develop.
>
> After coating, followed by 180 - 240 sec. bakd at 110 C.  Exposures are
> done on a contact aligner tool.  Maybe, this is a problem area, develop on
> a batch station for 4-5 min.
> What happen during this process and why?
>
> Thank you for sharing your experience and informaion.
>
>
> Jason Rim / AIO
> e-mail : jasonr@aio.com
>
>