The processing conditions that worked well are listed here under.  also (at
least in Europe and Australia) they sell the 4500 series too.  supposedly
4620 and 4562 should behave the same way, but the latter has been designed
not to be affected during contactup plating:

Here we go:

Evoporate seed layer  (I used Ti/Ni 300A each)
Spin HMDS, 5000 rpm 30 sec (It is not required, but I felt it worked better!)
Spin resist  3000 rpm 60secs (about 8.5um thick resist)
softback in convection oven, 90C, 18 min

Exposure time (MJB-3 mask aligner)  60 seconds

Edge bead removal and electrical contact lithography (outside ring - 120 sec)

Developed in MIF726.  Development time 80 secs.

Plating at lower current densities and lower temperatures than recommended
helped, as did application of potential before immersion.

Goodluck

shekhar


At 08:21 AM 2/13/99 -0800, Arbuckle, Brian wrote:
>Shekhar,
>
>Could you please let me know the process conditions for the photoresist,
>e.g. thickness, softbake time and temp, etc.
>
>Thanks,
>BWA
>
>-----Original Message-----
>From: Shekhar Bhansali [mailto:shekhar.bhansali@uc.edu]
>Sent: Tuesday, February 09, 1999 6:22 PM
>To: MEMS@ISI.EDU
>Subject: Re: Thick Resists for Au plating
>
>
>I've used AZ 4562 in the past to electroplate Au.  I'm not sure what the pH
>of the solution was (I think it was around 8).  I had used a commercial
>electroplating solution PUR=A-GOLD 402 sold by Enthone-OMI, Australia.
>
>You could use cured polyimide or photoresist but they would need to be
>ashed.
>
>Shekhar
>
>At 06:35 PM 2/9/99 +0000, Todd Green wrote:
>>Hi,
>>
>>I'm looking for resists that can be spun up to around 25 microns and have
>>good compatability with alkaline (pH=10) gold sulfite plating bath. We are
>>using SJR 3740 but are interested in other alternatives. We tried SU-8
>>but can't find anything to remove it. Is there anything else available?
>>
>>Thanks,
>>
>>Todd Green
>>
>>
>>
>
>
>