Hello Jerry,


I suggest you to look at the following papers:


Thierry Corman, Peter Enoksson and G=F6ran Stemme, "Deep wet etching of
borosilicate glass using an anodically bonded silicon substrate as
mask", Journal of Micromechanics and Microengineering 8 (1998) 84-87.


Shuichi Shoji, Hiroto Kikuchi and Hirotaka Torigoe, "Low-temperature
anodic bonding using lithium aluminosilicate-B-quartz glass ceramics",
Sensors and Actuators A 64 (1998) 95-100.


As described in these two papers it is difficult to etch deep in pyrex
glass with a conventional Cr/Au mask. A practical solution is to use
SD-2 glass instead of pyrex, which etches faster than pyrex with less
underetching: with a conventional Cr/Au/resist mask it is possible to
etch through the SD-2 glass (500 =B5m). As pyrex, SD-2 is suitable for
anodic bonding with silicon.


Good luck!


Thierry



>hi, Everybody:

>       I am trying to etch microchannel on glass (borosilicate glass,7740),

>but, lack of the support to do LPCVD poly-silicon on glass, the only
subsitution

>I know is Cr/Au, but I really don't know if it can resist deept
etching for me,

>about 320 mu m...

>       Besides, I don't know if amorphous silicon can resist to HF etching,

>I want to do deep etching, so I will use HF about 48% solution...

>       Any suggestions will be granted! I will appreciate..

>

>       Thanks a lot,

>       Sincerely

>

>Jerry Lee

>Insitute of Applied Mechanics

>email: r6543023@gauss.iam.ntu.edu.tw / iamjhlee@email.com

>

>=20