Hi ,
    Does the peeling-off comes fro the nature of isotropic etching's
undercut ? or another kind of underetching?
Best regards,
____________________________________________
Jerry Lee
(Jia-Hong Lee)
Insitute of Applied Mechanics,
National Taiwan University
Taipei, Taiwan, ROC
e-mail:
iamjhlee@email.com
r6543023@gauss.iam.ntu.edu.tw
"Try then error is better than no try"
-----Original-----
>For such deep etching, you might still need to use the poly as your mask
>material.  Cr/Au will likely be peeled off due to too much undercuting.
>
>Good luck,
>Chialun
>---------------------------------------------
>Chia-Lun Tsai, Ph.D.
>   Research Scientist
>   Integrated Sensing Systems, Inc.
>   387 Airport Industrial Dr.
>   Ypsilanti, MI 48198
>   Phone: (734) 547-9896, Ext.115
>   Fax: (734) 547-9964
>   Email: chialun@mems-issys.com
>   http://www.mems-issys.com/
>
>
>
>-----Original Message-----
>From: Jia-Hong Lee 
>To: MEMS@ISI.EDU 
>Date: Tuesday, February 23, 1999 7:56 PM
>Subject: Etching Mask for BSG(Corning 7740)?
>
>
>>
>>hi, Everybody:
>> I am trying to etch microchannel on glass (borosilicate glass,7740),
>>but, lack of the support to do LPCVD poly-silicon on glass, the only
>subsitution
>>I know is Cr/Au, but I really don't know if it can resist deept etching
for
>me,
>>about 320 mu m...
>> Besides, I don't know if amorphous silicon can resist to HF etching,
>>I want to do deep etching, so I will use HF about 48% solution...
>> Any suggestions will be granted! I will appreciate..
>>
>> Thanks a lot,
>> Sincerely
>>
>>Jerry Lee
>>Insitute of Applied Mechanics
>>email: r6543023@gauss.iam.ntu.edu.tw / iamjhlee@email.com
>>
>>
>>
>