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MEMS Discussion Group,
=20
I am in search of a prototype manufacturing source for drilling =
micro-vias on glass wafers. Laser drilling or sand blasting seems like =
good candidates. I need holes of diameter of about 150 micrometers on a =
7740 glass wafer. Any help would be greatly appreciated.
Chia-Lun Tsai, Ph.D.
Research Scientist
Integrated Sensing Systems, Inc.
387 Airport Industrial Dr.=20
Ypsilanti, MI 48198
Phone: (734) 547-9896, Ext.115
Fax: (734) 547-9964
Email: chialun@mems-issys.com
http://www.mems-issys.com/
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charset="iso-8859-1"
Content-Transfer-Encoding: quoted-printable
MEMS Discussion Group,
I am in search of a prototype manufacturing =
source for=20
drilling micro-vias on glass wafers. Laser=20
drilling or sand blasting seems like good candidates. I need holes =
of=20
diameter of about 150 micrometers on a 7740 glass wafer. Any help =
would be=20
greatly appreciated.
Chia-Lun Tsai, =
Ph.D.
=20
Research Scientist
Integrated Sensing Systems,=20
Inc.
387 Airport Industrial Dr.
=
Ypsilanti, MI=20
48198
Phone: (734) 547-9896, Ext.115
=
Fax: (734)=20
547-9964
Email: chialun@mems-issys.com
&nbs=
p; =20
http://www.mems-issys.com/
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