durusmail: mems-talk: Micro-via on glass wafer
Micro-via on glass wafer
1999-03-10
Micro-via on glass wafer
Chialun
1999-03-10
This is a multi-part message in MIME format.

------=_NextPart_000_00B4_01BE6AE0.FC91E170
Content-Type: text/plain;
        charset="iso-8859-1"
Content-Transfer-Encoding: quoted-printable

MEMS Discussion Group,
 =20

  I am in search of a prototype manufacturing source for drilling =
micro-vias on glass wafers.  Laser drilling or sand blasting seems like =
good candidates.  I need holes of diameter of about 150 micrometers on a =
7740 glass wafer.  Any help would be greatly appreciated.


Chia-Lun Tsai, Ph.D.
   Research Scientist
   Integrated Sensing Systems, Inc.
   387 Airport Industrial Dr.=20
   Ypsilanti, MI 48198
   Phone: (734) 547-9896, Ext.115
   Fax: (734) 547-9964
   Email: chialun@mems-issys.com
   http://www.mems-issys.com/


------=_NextPart_000_00B4_01BE6AE0.FC91E170
Content-Type: text/html;
        charset="iso-8859-1"
Content-Transfer-Encoding: quoted-printable









MEMS Discussion Group,
 
 
  I am in search of a prototype manufacturing = source for=20 drilling micro-vias on glass wafers.  Laser=20 drilling or sand blasting seems like good candidates.  I need holes = of=20 diameter of about 150 micrometers on a 7740 glass wafer.  Any help = would be=20 greatly appreciated.
 
 
Chia-Lun Tsai, = Ph.D.
  =20 Research Scientist
   Integrated Sensing Systems,=20 Inc.
   387 Airport Industrial Dr.
   = Ypsilanti, MI=20 48198
   Phone: (734) 547-9896, Ext.115
   = Fax: (734)=20 547-9964
   Email: chialun@mems-issys.com
&nbs= p; =20 http://www.mems-issys.com/
 
------=_NextPart_000_00B4_01BE6AE0.FC91E170--
reply