Hi everybody,

a question concerning the electrical characterization of neighboring
wires (on chip):
When calculating the dissipation factor (or loss tangent) between two
adjacent wires only the dielectric substrate is considered as path for
leakage. However, in a realistic environment a thin film of condensed
water should be present, and could, depending on its thickness (or
humidity) contribute to the dielectric loss. Does anybody have an idea
of the water film thickness? I couldn't find anything in literature. Is
it necessary to consider it at all? Any help would be very much
appreciated.

Regards,
Matthias

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Matthias Heschel
Microelectronics Center
Technical University of Denmark, Bldg. 345 east
DK-2800 Lyngby