Hello, I have to test anodic bonded Devices. Can anybody send me some informations about the following test-topics. 1. Bond Strength (static, dynamic Tets) 2. Hermeticity 3. mechanical Stress 4. Life-Time Prediction and other Tests if known. Thanks=20 Roy Knechtel xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx =09Haarbergstra=DFe 61 Tel.: 03 61 - 420 53 - 28 =09 99097 ERFURT Fax.: 03 61 - 420 53 - 28 =09 GERMANY e-mail: rkn@xfab.com =09 =09 xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx=09 X-FAB Gesellschaft zur Fertigung von Wafern mbH =09