You may contact the company, Bullen Ultrasonics.
Their homepage is,

http://www.bullen-ultrasonics.com/



Chialun wrote:

> This is a multi-part message in MIME format.
>
> ------=_NextPart_000_00B4_01BE6AE0.FC91E170
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>         charset="iso-8859-1"
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>
> MEMS Discussion Group,
>   I am in search of a prototype manufacturing source for drilling =
> micro-vias on glass wafers.  Laser drilling or sand blasting seems like =
> good candidates.  I need holes of diameter of about 150 micrometers on a =
> 7740 glass wafer.  Any help would be greatly appreciated.
>
> Chia-Lun Tsai, Ph.D.
>    Research Scientist
>    Integrated Sensing Systems, Inc.
>    387 Airport Industrial Dr.=20
>    Ypsilanti, MI 48198
>    Phone: (734) 547-9896, Ext.115
>    Fax: (734) 547-9964
>    Email: chialun@mems-issys.com
>    http://www.mems-issys.com/
>



--
Sincerely,
~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
Hyoung J. Cho

choh@email.uc.edu
Center for Microelectronic Sensors and MEMS
391 ERC, Electrical Engineering Dept.
Univ. of Cincinnati
Cincinnati OH 45221-0030

Fax (513) 556-7326/7405
Phone (513) 556-4795/1997

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