Excimer Laser machining will work provided you use 193nm. A 150 micrometre
diameter hole is no problem but I need more information i.e. What depth? Is
taper
angle an issue? If it is do you want the 150 micron hole be the exit diameter?
Best wishes,
Erol Harvey.
Chialun wrote:
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> MEMS Discussion Group,
> =20
>
> I am in search of a prototype manufacturing source for drilling =
> micro-vias on glass wafers. Laser drilling or sand blasting seems like =
> good candidates. I need holes of diameter of about 150 micrometers on a =
> 7740 glass wafer. Any help would be greatly appreciated.
>
> Chia-Lun Tsai, Ph.D.
> Research Scientist
> Integrated Sensing Systems, Inc.
> 387 Airport Industrial Dr.=20
> Ypsilanti, MI 48198
> Phone: (734) 547-9896, Ext.115
> Fax: (734) 547-9964
> Email: chialun@mems-issys.com
> http://www.mems-issys.com/
>
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> MEMS Discussion Group,
>
> I am in search of a prototype manufacturing =
> source for=20
> drilling micro-vias on glass wafers. L color=3D#000000>aser=20
> drilling or sand blasting seems like good candidates. I need holes =
> of=20
> diameter of about 150 micrometers on a 7740 glass wafer. Any help =
> would be=20
> greatly appreciated.
>
>
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--
-------------------------------------------------
Erol Harvey
Associate Professor
Deputy Director
Industrial Research Institute Swinburne
Swinburne University of Technology
PO Box 218
Hawthorn, Victoria 3122
Australia
Tel :+ 61 (0)3 9214 5111
FAX: + 61 (0)3 9214 5050