Chialun: Good to hear from you. Well FIB as you know it s an ideal tool for generating sub-micron features. Since your hole dia is 150 microns and depth of 750 microns, we have other techniques in-house. We have modified our FIB system and is being used as an maskless implantation tool. The implantation process is fully automated and can handle any kind of CAD or Bitmap file format. By combining our FIB patterning technique with RIE generating such features should not be a problem. We are publishing a paper on some of these technique we have developed at Norsam Technologies (http://www.norsam.com) in HARMST'99 conference in Japan. Thank you and let me know if you have any other questions or want us to help you in any way. Regards Jayant ****************************************************************** Jayant Neogi Vice President & Chief Technical Officer Norsam Technologies Ph# (503) 640-0586 Fax# (503) 640-8117 ****************************************************************** -----Original Message----- From: ChialunTo: Jayant Neogi Date: Thursday, March 11, 1999 5:48 AM Subject: Re: Micro-via on glass wafer >Dear Jayant: > I'm very interested. Our 7740 glass wafer is 750um thick, can you use >FIB to drill such thick wafer in large numbers? > >Thanks very much, >chialun > >-----Original Message----- >From: Jayant Neogi >To: Chialun >Date: Wednesday, March 10, 1999 10:12 PM >Subject: Re: Micro-via on glass wafer > > >>Hi: >> >>We at Norsam Technologies can do this work for you, currently we are doing >>very similar work for Caliper Tech. We are using Focused Ion Beam >technology >>to drill hole and can obtain holes as small as 12 nm. Let me know if we can >>be of any help to you. Thank you. >> >>Regards >>Jayant >>****************************************************************** >>Jayant Neogi >>Vice President & Chief Technical Officer >>Norsam Technologies >>Ph# (503) 640-0586 >>Fax# (503) 640-8117 >>****************************************************************** >> >>-----Original Message----- >>From: Chialun >>To: MEMS@ISI.EDU >>Date: Wednesday, March 10, 1999 5:55 PM >>Subject: Micro-via on glass wafer >> >> >>>This is a multi-part message in MIME format. >>> >>>------=_NextPart_000_00B4_01BE6AE0.FC91E170 >>>Content-Type: text/plain; >>> charset="iso-8859-1" >>>Content-Transfer-Encoding: quoted-printable >>> >>>MEMS Discussion Group, >>> =20 >>> >>> I am in search of a prototype manufacturing source for drilling = >>>micro-vias on glass wafers. Laser drilling or sand blasting seems like = >>>good candidates. I need holes of diameter of about 150 micrometers on a = >>>7740 glass wafer. Any help would be greatly appreciated. >>> >>> >>>Chia-Lun Tsai, Ph.D. >>> Research Scientist >>> Integrated Sensing Systems, Inc. >>> 387 Airport Industrial Dr.=20 >>> Ypsilanti, MI 48198 >>> Phone: (734) 547-9896, Ext.115 >>> Fax: (734) 547-9964 >>> Email: chialun@mems-issys.com >>> http://www.mems-issys.com/ >>> > >