Folks:

    I am seeking references to high vacuum components (or systems)
fabricated "on chip" with MEMS. And any info
regarding the use of gas evolving explosives or "exploding wire"
technology applied to MEMS fabrication, implantation,
or power source to drive components....

    In particular, I am considering an array of parallel/serial
configured turbomolecular pumping elements, or condensation/diffusion
pumps with heat exchangers.
    Also, have "microencapsulated" explosives been used in
fabricating devices? ie: gas evolving nitro detonated by laser or e-beam
and pumped out. This could provide for
"coarse" excavation of large areas of material very quickly.
    (I have more thoughts on these matters, but need a reality check
from experienced engineers!)
   Thank you for your responses... I am new to this fascinating and
inspiring technology.

Saul Malamud
 Pacific Polytechnic Institute
agile@serv.net    206-860-7315