We are using the saturated KI (Potassium Iodid) solution + I2  (Iodine) to
etch thin layer of E-beam evaporated gold films (40 nm to 100 nm range).

The etch-mixture works well, but the etch-rate is a bit too high in the case
of such thin layers.

Do some know of way to slow down the etch-rate (by dilution or otherwise).

best regards

Peter Gravesen
Micro Technology Group (BC-ER)
Danfoss A/S
Nordborgvej 81
Building E14-S9
DK-6430 Nordborg
DENMARK
Phone:  +45 7488 2439
FAX     +45 7588 4000
E-MAIL: peter.gravesen@danfoss.com