We would appreciate the opportunity to talk with those on the mailing list
having experience with working with ultra-thin (~10 microns thick)
double-side polished Si wafers.  We are thinking of etching a fairly simple
pattern directly through the wafer.  We have used, on thicker wafers (~70
microns thick) the Bosch deep etch.  The purpose of this message is simply
to make contact with those MEMS workers who have worked with processing
wafers in the 10 micron thickness range.

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Dr. Kevin Ausman
Laboratory for the Study of Novel Carbon Materials
Department of Physics
Washington University
CB 1105, One Brookings Drive
St. Louis, MO 63130-4899

Lab:  314-935-7507 (Messages can be unreliable)
VoiceMail: 314-370-4917
Fax:    314-935-5258

E-Mail: ausman@hbar.wustl.edu
Web:    http://bucky8.wustl.edu
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