durusmail: mems-talk: Aluminum/Polyimide Surface Micromachining
Aluminum/Polyimide Surface Micromachining
1999-12-14
1999-12-25
Aluminum/Polyimide Surface Micromachining
ofir degani
1999-12-14
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Hello all,

I am Ofir Degani, a Ph.D. student at the Technion - Israel Institute of
technology.

We have started to develop a surface micromachining process with
Polyimide as sacrificial layers and Aluminum (or other metals) as the
structural layer. This is to produce some electrostatic actuators mainly
for experiments with the electrostatic actuation.

We are spin coating the polyimide (thickness about 5 micron but can be
varied) and curing it at 220C for one hour. The evaporating of the
aluminum structural layer is done at about 2*10e-7 torr.

We have used as references the works of:

1) Seok-Whan Chung et. al, Sens&Act. ,54 ,1996, 464-467
2) Jong-Woo Shin et. al, Sens&Act., 66, 1998, 144-149
3) Texas Instrument DMD work.


We have achieved to release the structural layer by Oxygen plasma as was
recommended by 1+2.

Nevertheless, the aluminum actuators were bent towards the silicon wafer
surface. It seems that there is a stress gradient in the aluminum layer.

I would appreciate any suggestions or knowledge or paper referring to
this problem and how to solve it and reduce the stress gradient in the
aluminum layer. (1),(2) and (3) have succeeded in that so it probably
can be done but it is not written in these papers how.


Thank you and SHALOM

Ofir

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