Hi,

I would like to post the following question to the discussion group:

Is there anyone who knows if it is possible to etch 6 µm deep, 0,5 µm wide
grooves in silicon dioxide (like a fused silica wafer) with perfectly
smooth sidewalls? Can one use ordinary RIE and photoresist or does one need
a DRIE, ICP or  other techniques?

Johan Holm || IBSEN Micro Structures A/S
Gammelgaardsvej 65 | DK-3520 Farum | Denmark
Tel.: (+45) 44 99 55 60 | Fax.: (+45) 44 99 55 61
johan.holm@ibsen.dk | www.ibsen.dk