Hello everybody,

we are building a bulk-micromachined acceleration sensor.
Therefore we have to bond silicon to pyrex anodically.
Unfortunatly the seismic masses of the silicon tend to bond
to the pyrex (to be exactly they bond to the gold electrodes
on the pyrex).
Can anybody tell me how to avoid the bonding of such
moveable structures?
Is there an literature on this effect?

Best regards
Stefan Beissner

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