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Hello,

I need information of how to reduce the stress gradient in the aluminum
layers in a surface micromachining process containing polyimide as a
sacrificial and aluminum as strcural layer.

The polyimide is spun to 5 micron and cured at 220degrees. The aluminum
was evaporated at about 0.1microTorr with 15Angs/sec rate.

Thank you

Ofir Degani

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n:BOCHOBZA-DEGANI;OFIR
tel;cell:972-54-889646
tel;fax:972-4-8322185
tel;home:972-4-8200520
tel;work:972-4-8292763
x-mozilla-html:FALSE
org:Technion - Israel Institute of Technology;Kidron's Microelectronics Research
Center - Electrical Engineering Department
adr:;;Technion City;Haifa;;32000;Israel
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email;internet:ofird@tx.technion.ac.il http://www-ee.technion.ac.il/~ofird/
title:Ph.D. candidate
fn:Ofir Bochobza-Degani
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