Hello all:
I'm trying to determine quantitatively the strength of silicon-to-silicon
bonds compared to anodically bonded silicon-to-glass bonds. I'm interested
in bond strength when applying pressure to a cavity etched in one of the
silicon wafers in the bonded pair. Applied pressures will range from 500-
4000 psi. I'd appreciate any data or resources that you may know of in this
regard.
Thanks

Rich Hjulstrom
Siemens Moore Process Automation, Inc.
(215) 646-7400 x2420
(215) 591-0420 Fax
mailto:rah@moore-solutions.com
http:\www.moore-solutions.com