Dear Weng On,

I assume that you cannot pattern (etch) one of the wafers so that only
certain surface regions of the wafer are available for bonding. In that
case, for silicon direct/fusion bonding there have been some reports of
selectively roughening wafer surfaces to limit bonding in those areas.

Please contact me directly for more information and to discuss your
application in greater detail.

Regards,
Andy Mirza
Technology Manager
Electronic Visions, Inc.
3701 E. University Drive
Ste. 300
Phoenix, AZ 85034
Tel: (602) 437-9492
Fax: (602) 437-9435
E-mail: a.mirza@elvisions.com
Web: http://www.elvisions.com

=============================================



-----Original Message-----
From: choong weng on [mailto:cwengon@yahoo.com]
Sent: Tuesday, December 28, 1999 1:03 AM
To: Mirza Andy; mems-cc@ISI.EDU; MEMS@ISI.EDU
Subject: Selective Wafer Bonding


Dear All,

  I need to bond two wafers but selectively at certain
locations only.  Please provide me any information
with regards to selective wafer-wafer bonding?  Thank
you very much.

Weng On



=====
Best Regards,
Yongan
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