Dear Colleagues,
Since I am finding how helpful the group with problems and going to hit you
with a big one for me and hopefully someone can lead me in the right
direction. We started out just being a producer of electro-exploded nano
metal powders and I am now trying to absorb the microelectronics industry.
While doing R&D work on nano powders we developed a process that we believe
has significant potential but Im not sure where it has a place in MEMS.  I
guess you could say it's " brush on auto catalytic deposition"?  or "high
speed brush electroless plating"?  Its a new improvement on brush plating
except there is no current needed and its a simple paint on technique.  It
is capable of depositing a number of metals including copper, nickel, tin
and gold.  The advantages are: For in-house plating, touch-up applications,
it may be amenable for patterning and lithography, it avoids the need for
masking, and it can deposit elemental nickel as compared to high resistivity
electroless nickel phosphorous, etc.   So gang, what Im looking for is ideas
on what to call this and where it may find a home when the process is fully
developed?   All opinions are welcome and greatly appreciated. Thanks again
for everyone's kind advice.

Cindi

Cindi Prorok
cindi@argonide.com
Argonide Nanomaterials
www.argonide.com