Hi MEMS_Community,
we are a producer of inclination sensors, based on a
glas/silicon/glas-stack. The glas and silicon is connected by
anodic bonding, a very reliable and strong connecting methode. But
from time to time we are interested to open a sensor to have a look
inside it.

Have anybody a hint, if it is possible to open such a system,
without damaging the silicon.

Because I think that the question above is from general interest, I
will collect the replies and will post it here.

Thank you in advanced
Dirk



Dirk Zielke
GEMAC mbH
Zwickauer Str. 227
09116 Chemnitz
Germany
Tel.: +49 371 3377 131
Fax.: +49 371 3377 272
email: info@gemac-chemnitz.de
http://www.gemac-chemnitz.de (Deutsch)
http://www.gemac-chemnitz.de/mst/mst_eng.htm (English)