Dear Tony Rogers, hi mems community,
unfortunatly there was only one responses on my questions, to
crack silicon/glas anodic bonding. Thank you Mr. Eniko T. Enikov for
there efforts.   I have the email attached below.

But I think that the question is still alive and from general interest.
So if anybody has an idea, I am willing to take part on experiments
on this field.

With kind regards
Dirk Zielke

********************************************************************
The Si-Pyrex bond is considered chemical bond due to formation of Silicon
Oxide from the Oxygen in the glass. In order to open your sensor, you need
to destroy this oxide layer. One possible expensive procedure would be to
grind down the glass until you are left with let's say 10-15 microns and
then try to use wet or dry etching. This might damage the Si side if you
have any oxides there.
.....
Alternatively,
If you have a bare Si on one side and the glass on the other, you may want
to use Si-Au eutectic bond.
Then, when you decide to open it, you will need to re-hear the stack, until
all the Au is dissolved into the Si.

Greetings,
Eniko


Eniko T. Enikov, Ph.D.
Assistant Professor
Department of Aerospace and Mechanical Engineering
University of Arizona
1130 N. Mountain
P.O. Box 210119
Tucson, AZ 85721
Tel.(520) 621-4506
Fax(520) 621-8191
e-mail: enikov@engr.arizona.edu

********************************************************************
> Dera Dirk,
>
> Did you ever receive any replies to your question. If so I would be grateful
> if you could e=send them on to me.
>
> Regards
>
> Tony
>
> Tony Rogers
> Applied Microengineering Ltd
> 68 Milton Park
> Abingdon
> Oxon. OX14 4RX
>
> Tel. +44 (0)1235 833934
> Fax +44 (0)1235 833935
> WWW: http://www.aml.co.uk
> E-mail:tony@aml.co.uk
> -----Original Message-----
> From: Dirk Zielke 
> To: MEMS@ISI.EDU 
> Date: 13 September 2000 17:22
> Subject: Dissolve Glas/Silicon Bonds
>
>
> Hi MEMS_Community,
> we are a producer of inclination sensors, based on a
> glas/silicon/glas-stack. The glas and silicon is connected by
> anodic bonding, a very reliable and strong connecting methode. But
> from time to time we are interested to open a sensor to have a look
> inside it.
>
> Have anybody a hint, if it is possible to open such a system,
> without damaging the silicon.
>
> Because I think that the question above is from general interest, I
> will collect the replies and will post it here.
>
> Thank you in advanced
> Dirk
>
>
>
> Dirk Zielke
> GEMAC mbH
> Zwickauer Str. 227
> 09116 Chemnitz
> Germany
> Tel.: +49 371 3377 131
> Fax.: +49 371 3377 272
> email: info@gemac-chemnitz.de
> http://www.gemac-chemnitz.de (Deutsch)
> http://www.gemac-chemnitz.de/mst/mst_eng.htm (English)
>
>
>


Dr. Dirk Zielke
GEMAC mbH
Zwickauer Str. 227
09116 Chemnitz
Germany
Tel.: +49 371 3377 131
Fax.: +49 371 3377 272
email: info@gemac-chemnitz.de
http://www.gemac-chemnitz.de (Deutsch)
http://www.gemac-chemnitz.de/mst/mst_eng.htm (English)