Dear Colleagues:

I have been working on thick resists for some time.
There has been a lot of discussions about SU-8 thick
resists.

I have some questions if some of you can answer.

Techniques for removal of SU-8 resist.

(1) Don't hard bake the resist.  It definately helps
in removal better then when it is hard baked at 150 C

(2) Use of Nano SU-8 remover solution at 80 C provided
by MCC company

(3) Use of dry etching techniques for removal

But the problem that I faced is that after I have
plated thick structures (60 to 100 microns) in SU-8
resist cavities (plating bath temperature is below 60
C), It is sometimes difficult to remove small chunks
of resists along the edges of the thick plated metal.
Due to some reasone I cannot put the samples in dry
etch for too long a time.

Does some one out there know of a better solvent or
dry etching gas or some other technique which can be
used for efficient removal of SU-8 each and every
time.

What other thick resists (UV resists only) can be used
which can be spun to a thickness of approx 100 microns
and can be processed (patterned, plating in cavities
and removal). (without much of a learning curve
hopefully)

I will be very thankful for the answers and will
compile and post the list of all the answers on the
discussion board.

Thanks in advance

Sincerely
Vikas
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